Automated solder paste management system with precise temperature control, from refrigerated storage to ambient temperature conditioning and mixing. Ensure optimal solder paste performance with complete traceability and scheduled release for SMT production.
Refrigerated storage area (5-10°C)
Ambient temperature conditioning (4-6 hours)
Integrated mixer with programmable speed
IPC-1782 Level 4 traceability
Refrigeration
Conditioning
Traceability
Critical component in SMT assembly process
Solder paste is a combination of metal solder particles and flux. The flux cleans soldering surfaces of impurities and oxidation while providing temporary adhesion for surface mount components.
Proper handling ensures solder paste maintains thixotropic properties during printing and placement, retaining tackiness for component adhesion during reflow.
From receiving to production line release
Solder paste intake
5-10°C storage
Temperature conditioning
Homogenization
Scheduled delivery
Complete tracking
Advanced capabilities for optimal solder paste management
Maintains optimal 5-10°C storage temperature to preserve solder paste chemistry and extend shelf life
Programmable conditioning area ensures paste reaches room temperature before seal breaking (4-6 hours)
User-controlled speed and timing ensures even distribution of separated materials throughout paste
Precision weighing for accurate inventory management and usage tracking
Automatic barcode scanning for instant identification and tracking
Programmable material release synchronized with production schedules
Solder paste’s complex composition requires precise handling throughout its lifecycle. Without proper management, chemistry degradation occurs before use, leading to defects and production issues.
Temperature affects viscosity and print definition
Proper tackiness ensures components stay in position
Controlled chemistry ensures optimal solder joint formation
Minimize paste waste and eliminate process risks
Preheat
Preheat
Preheat
Preheat
Comprehensive specifications for SMD BOX SP
| System Capabilities | |||
|---|---|---|---|
|
Solder Paste Package |
Jar, Cartridge |
||
|
1D/2D Recognition |
Yes |
||
|
Weight Scale |
Yes |
||
|
Refrigeration Area |
Yes |
||
|
Temperature Range |
5-10°C |
||
|
Ambient Temperature Area |
Yes |
||
|
Mixer |
Yes |
||
|
Scheduled Release |
Yes |
||
|
Software |
SMF Integration |
||
Full compliance with IPC-1782 standard for manufacturing traceability and supply chain risk mitigation
Seamless connectivity with your production ecosystem
SMD BOX SP powered by Smart Material Flow software provides seamless integration to your existing IT infrastructure.
Achieve IPC Level 4 traceability with automated tracking at every stage of the solder paste handling process.
Reduce waste, eliminate process risks, and ensure consistent print quality with SMD BOX SP. Experience automated solder paste handling with complete temperature control and traceability.
